Mgr, OSAT Assembly Engineering

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Job Description / Accountabilities: 

• Manage Qorvo products for smooth ATI/NPI execution and HVM engineering
• Early engagement & execution of a Packaging Technology development working with Qorvo PKG team & OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs
• Could Manage multiple projects for package development from risk assessment, process /BOM establishment, qualification.
• Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
• Lead and Manage OSAT New Technology and New Product Introduction, Qualification, HVM, in a timely and flawless manner
• Strong problem-solving skill in Assembly engineering and leadership working with OSATs partner & cross functional team in Qorvo
• Strong communication, presentation skills, ability to excel in a dynamic collaborative team environment including working directly with the R&D, Quality and Product line is necessary.
• Think and act professionally in the consistent Manner as a Qorvo engineering representative of on-site OSAT
• Manage/Coach QI’s engineering resource from the daily work
• Able to implement Continuous process improvement and innovation Value Engineering projects
• Could manage other work centers as well upon requested
• Report to Engineering Director in Singapore Qorvo International

Requirements:

• Good communication skill with open minded to learn semiconductor area: Bumping, DPS and Assembly process
• Bachelor’s or master’s degree in mechanical engineering, Material Science engineering or a related field
• Minimum 10 years in semiconductor packaging or assembly engineering industry
• Good attitude, detail-orientated, proactive, quick learner and able to work effectively in a fast-paced environment
• Proven strong interpersonal and communication skills with willingness to take accountability
• Ability to address internal and external customer complaints and do multi-tasking
• Ability to lead cross-functional teams and drive supplier performance

Language

• English fluency in addition to Chinese language working with OSATs & Customers who are chinese speaking in countries like China & Taiwan

#LI-MC1

MAKE A DIFFERENCE AT QORVO   

 We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.