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Senior Module Design Engineer

Experience Level:  Individual Contributor
Job Type:  Full-Time

TX - Richardson, US

Requisition ID:  7531

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit to learn how our diverse and innovative team is helping connect, protect and power our planet.


Qorvo (Nasdaq: QRVO) is All Around You! We make a better world possible by providing innovative Radio Frequency (RF) solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise, and global manufacturing scale to solve our customers’ most complex technical challenges quickly. 


It is an exciting time to be a part of Qorvo’s High Performance Analog Products. Qorvo’s HPA manufactures and markets high performance RF and mixed signal integrated circuits for the communications markets that connect, protect and power the world. Our customers trust Qorvo to meet and exceed requirements and deliver advanced RF technologies to enable their most complex technical challenges and applications.  Our customers rely on us to solve the industry’s most complex engineering problems and that requires brain power and willingness to create and innovate.  Join us and help us continue to create cutting edge technologies for a more connected world all around you.


We are looking for a Senior Module/Packaging Design Engineer responsible for the development of innovative, cutting-edge RF/Microwave module/packaged products. This will involve design and development of single or multi-chip modules that would integrate GaN, GaAs or Silicon based MMICs in various type of advanced state-of-the-art packaging technologies. Additionally, depending on experience level, a portion of your time could be involved in mentoring other team members in contributing new and innovative design ideas. You will be a key member of an integrated product development team that includes marketing, program management, mechanical engineering, product engineering, package engineering, test engineering, applications engineering, manufacturing, operations, quality and reliability, and senior management. 



  • Technical lead role for RF/mm-wave single or multi-chip module (MCM) design.
  • Advanced package design using 2.5D and 3D electromagnetic simulators.
  • Work with EDA team to develop the package and assembly-related design kits.
  • Integrate MMIC(s) into air cavity or over-molded modules towards innovative product solutions.
  • Support product checkout, optimization, design verification, and testing in the test lab.
  • Support technical discussions with internal and external customers.
  • Support design documentation through the product lifecycle, including concept/feasibility, development, qualification, and production.



  • Expert level experience in integrating microwave/millimeter-wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive front-end modules (FEMs).
  • Expert-level user in 3D EM simulation tools such as HFSS and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
  • Expert in analyzing performance tradeoffs of FEMs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
  • Strong understanding of electromagnetic theory and RF fundamentals such as s-parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
  • Hands on experience in microwave measurements, characterization, and calibration methods.
  • Knowledge of advanced semiconductor technologies such as GaN, GaAs and/or Silicon.
  • Broad knowledge of semiconductor RF/power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub-assemblies.
  • Knowledge of antenna design is a plus.
  • Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.
  • Published author in technical journals and/or magazines.
  • Strong ability to meet customer technical needs and schedules.
  • BS Electrical Engineering with 7 or more years of experience
  • MS Electrical Engineering with 3 or more years of experience
  • Ph.D. Electrical Engineering (with RF/Microwave focus) with relevant experience

This position requires access to ITAR/EAR technologies. Applicant must be a US Person (US citizen, permanent resident, asylee, or refugee) or eligible to obtain necessary export authorizations.




We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.


We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.

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