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Staff Packaging Engineer

Experience Level:  Individual Contributor
Job Type:  Full-Time
Location: 

TX - Richardson, US

Requisition ID:  2050

SUMMARY:

The ideal candidate will utilize semiconductor packaging engineering and materials experience to innovate, develop and drive new products and packaging technologies. Work with next generation of product requirements from concept to high volume manufacturing.

RESPONSIBILITIES:

  • Drive the selection, development, and ramp of new packaging materials and roadmap-driven packaging technologies
  • Provide best in the class industry “know-how” to enable continued global leadership of semiconductor packaging solutions
  • Utilize program management methodology to plan, execute and monitor the complex process and/or product development projects
  • Design for manufacturability to ensure a smooth transition to High Volume Manufacturing
  • Work in collaboration with R&D and business unit groups to innovate and develop next-generation packaging solutions incorporating GaN, Si, and GaAs semiconductor devices.

QUALIFICATIONS:

  • Strong background in high power process/packaging technologies.  Preferably, direct experience in RF Modules, high power or high-frequency packages in the infrastructure, aerospace, and/or defense industries is preferred.
  • Ability to excel in a dynamic, collaborative team environment, including working directly with design, wafer fab, materials, prototype, and OSAT representatives 
  • Thorough industry knowledge and experience with organic-based die attach and flip-chip technologies.
  • Experience working and developing assembly materials for manufacturability, reliability, and performance improvements is a big plus. i.e., Sintered, High thermal, soldering materials, and advanced packages    
  • Knowledgeable across a wide range of assembly, packaging, processes technologies, and materials. e.g., SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, etc.
  • Possess knowledge/training in Project Management, Lean manufacturing, and SPC & DMAIC skillsets
  • Experience with ceramic, laminates, high power, high-frequency devices is preferred.
  • Strong understanding of Design for Manufacturability
  • Strong communication and presentation skills
  • B.S. in Engineering minimum, Materials, Chemical, Physics or similar. Master’s degree preferred. An advanced degree is a plus.
  • 5 years minimum experience in electronic packaging or related fields

Because this position is part of a business unit that contracts with the US government, qualified candidates must be U.S. persons (generally a US citizen or green card holder). Individuals holding temporary visas, such as F-1 or H-1B, are not U.S. persons

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MAKE A DIFFERENCE AT QORVO   

 

We are Qorvo. We do more than create innovative RF solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

 

We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.


Nearest Major Market: Dallas
Nearest Secondary Market: Fort Worth

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