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Sr. Module Design Engineer

Experience Level:  Individual Contributor
Job Type:  Full-Time

TX - Richardson, US

Requisition ID:  555

Qorvo (Nasdaq: QRVO) is All Around You! We make a better world possible by providing innovative Radio Frequency (RF) solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise, and global manufacturing scale to quickly solve our customers’ most complex technical challenges. 

Qorvo's Infrastructure and Defense Products (IDP) revenue grew double digits for 13 consecutive quarters over 2016-2019 as it expanded into diverse, high-growth markets. Today, Qorvo IDP serves large markets including wireless connectivity, broadband, aerospace, defense, the IoT, and programmable power management. Through innovation and market leadership, IDP has established Qorvo's technology and product leadership in Gallium Nitride (GaN), expanding its use from defense radar and electronic warfare to commercial markets including 5G base stations and broadband cable networks.  We are a global company thriving on a culture of innovation, diversity, and inclusion. 

We are looking for a Senior Module/Packaging Design Engineer responsible for the development of innovative, cutting-edge RF/Microwave module/packaged products. This will involve design and development of single or multi-chip modules that would integrate GaN, GaAs or Silicon based MMICs in various type of advanced state-of-the-art packaging technologies. Additionally, depending on experience level, a portion of your time could be involved in mentoring other team members in contributing new and innovative design ideas. You will be a key member of an integrated product development team that includes marketing, program management, mechanical engineering, product engineering, package engineering, test engineering, applications engineering, manufacturing, operations, quality and reliability, and senior management. 


  • Technical lead role for RF/mm-wave single or multi-chip module (MCM) based product development.
  • Integrate MMIC(s) into air cavity or over molded modules towards innovative product solutions.
  • Advanced package design using 2.5D and 3D electromagnetic simulators.
  • Manage product checkout, optimization, and design verification testing (DVT) in the test lab.
  • Execute DVT analysis and present results to the internal and/or external customer.
  • Support product through critical lifecycle stages including concept/feasibility, development, qualification, and production.
    • Mentor others in design concepts and best practices.
    • Publish novel design work internally or externally (IEEE IMS, BCICTS, GOMAC, etc.) to promote Qorvo’s technology and design capabilities.  Submit invention disclosures for potential patents where applicable.


  • Expert level experience in integrating microwave/millimeter-wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive front-end modules (FEMs).
  • Expert-level user in 3D EM simulation tools such as HFSS and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
  • Expert in analyzing performance tradeoffs of FEMs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
  • Strong understanding of electromagnetic theory and RF fundamentals such as s-parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
  • Hands on experience in microwave measurements, characterization, and calibration methods.
  • Knowledge of advanced semiconductor technologies such as GaN, GaAs and/or Silicon.
  • Broad knowledge of semiconductor RF / power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub-assemblies.
  • Knowledge of antenna design is a plus.
  • Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.
  • Published author in technical journals and/or magazines.
  • Strong ability to meet customer technical needs and schedules.
  • BS Electrical Engineering with 7 or more years of experience
  • MS Electrical Engineering with 3 or more years of experience
  • PhD Electrical Engineering (with RF/Microwave focus) with relevant experience

Because this position is part of a business unit that contracts with the US government, qualified candidates must be U.S. persons (generally a US citizen or green card holder). Individuals holding temporary visas, such as F-1 or H-1B, are not U.S. persons.




We are Qorvo. We do more than create innovative RF solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.


We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.


Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.

Nearest Major Market: Dallas
Nearest Secondary Market: Fort Worth

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