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Senior Integrated Module Designer

Experience Level:  Professional
Job Type:  Regular
Location: 

Richardson, TX, US, 75081 Phoenix, AZ, US, 85002 Sacramento, CA, US, 94204 Denver, CO, US, 80014 Sacramento, CA, US, 94204 Sacramento, CA, US, 94204 San Jose, CA, US, 95134 Greensboro, NC, US, 27409 San Jose, CA, US, 95134 Chandler, AZ, US, 85226 Raleigh, NC, US, 27560 Newbury Park, CA, US, 91320 Torrance, CA, US, 90505 Boston, MA, US, 2108 San Diego, CA, US, 92121

Requisition ID:  8725

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

 

We are looking for a Senior Electrical Module/Packaging Design Engineer responsible for the development of innovative, cutting-edge RF/Microwave module/packaged products. This will involve design and development of single or multi-chip modules that would integrate GaN, GaAs or Silicon based MMICs in various type of advanced state-of-the-art packaging technologies. Additionally, depending on experience level, a portion of your time could be involved in mentoring other team members in contributing new and innovative design ideas. You will be a key member of an integrated product development team that includes marketing, program management, mechanical engineering, product engineering, package engineering, test engineering, applications engineering, manufacturing, operations, quality and reliability, and senior management. 


RESPONSIBILITIES:

  • Individual Contributor for RF/mm-wave single or multi-chip module (MCM) based product development.
  • Integrate MMIC(s) into air cavity or over molded modules towards innovative product solutions.
  • Advanced package design using 2.5D and 3D electromagnetic simulators.
  • Product checkout, optimization, and design verification testing (DVT) in the test lab.
  • Execute DVT analysis and present results to the internal and/or external customer.
  • Support product through critical lifecycle stages including concept/feasibility, development, qualification, and production.

REQUIRED TECHNICAL QUALIFICATIONS AND EXPERIENCE:

  • Experience in integrating microwave/millimeter-wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive front-end modules (FEMs).
  • Expert-level user in 3D EM simulation tools such as HFSS and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
  • Expert in analyzing performance tradeoffs of FEMs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
  • Strong understanding of electromagnetic theory and RF fundamentals such as s-parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
  • Hands on experience in microwave measurements, characterization, and calibration methods.
  • Knowledge of advanced semiconductor technologies such as GaN, GaAs and/or Silicon.
  • Broad knowledge of semiconductor RF / power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub-assemblies.
  • Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.

DESIRED EXPERIENCE:

  • Knowledge of RF signal chain and system analysis is a plus.
  • Knowledge of antenna design is a plus.
  • Published author in technical journals and/or magazines.
  • Strong ability to meet customer technical needs and schedules.

 

REQUIRED EDUCATION AND EXPERIENCE:

  • BS Electrical Engineering with 8 or more years of experience
  • MS Electrical Engineering with 5 or more years of experience
  • PhD Electrical Engineering (with RF/Microwave focus) with 2-3+ years of experience

 

Work Location:  Preferred location:  Richardson, TX.; Additional locations: CA, MA, NC, CO, AZ

Relocation Eligible:  Yes

 

 

This position is not eligible for visa sponsorship by the Company.

This position requires work on US Government contracts.  Applicants must be a US Person (US citizen, permanent resident, asylee or refugee).

 

Competitive base salary commensurate with experience: $118,200 - $153,700 (subject to change dependent on physical location)
Posted salary ranges are made in good faith. Qorvo reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as external competitiveness and internal comparability.
Base compensation is one element of Total Rewards offered at Qorvo. More information on the Total Rewards package can be shared upon request.

 

 

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MAKE A DIFFERENCE AT QORVO   

 

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

 

We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.


Nearest Major Market: Dallas
Nearest Secondary Market: Fort Worth

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