Modeling Engineering Intern

Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion. Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about Top 10 Reasons to make a career at Qorvo.

Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full time opportunities, as available.

Qorvo’s Internship Program offers:

* Challenging, skill-building assignments

* Mentoring and coaching from industry experts

* Lunch & Learns and other learning opportunities

* Collaborative team-based work environment

* Networking and social events

* Final presentation to business leaders

Qorvo’s Modeling Engineering Internships are offered in our Global Operations group. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

Responsibilities may include:

* Measure the DC, RF, Large Signal, Noise characteristics of individual active and passive semi-conductor devices.  

* Overlay the measurements with existing “SPICE-like” device model to gauge the model accuracy.

* Update or Extract a geometry dependent model for an active or passive device in either a silicon or GaAs technology.

* Validate the RF measurements of a semiconductor device using EM (Electro-Magnetic) simulation.    

* Code the model in SPICE/Verilog-A syntax, simulate the coupling for numerous active and passive devices, and compare to measured results.

* Add/Update the process variation in a compact device model using data available from Process Control Monitor (PCM) test structures.

Qualifications:

* MS in Electrical Engineering or Electrical and Computer Engineering.   

* 3.5 GPA or higher.

* At least two undergraduate (or higher) courses in semiconductor device physics.

* Problem solving experience using Python, Matlab, Spotfire or similar engineering software.

* Hands on electronics lab experience (DC/CV/RF measurements) preferred.

* Excellent communication skills a must.

* Ability to work well in a team is a given.