Laminate Engineering Intern

Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full time opportunities, as available.

Qorvo’s Internship Program offers:

• Mentorship Program
• Lunch and Learn Series
• Team based work environment
• Formal evaluation process with real time feedback
• Networking and social opportunities
• Meaningful assignments with a final presentation

The Packaging Engineering Intern will be exposed to full process flow for semiconductor assembly packaging with emphasis on HDI laminates utilized in multi-chip module packages, and semiconductor technologies.  

 Responsibilities:

• Learn best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions. 
• Work with internal stakeholders to optimize products, packages, and technologies.
• Depending on candidate experience, projects will be selected from the following areas:
  • Mechanical Materials characterization.
  • Reliability testing of products.
  • Electrical validation and characterization

Qualifications:

• Working towards BS / MS in Mechanical Engineering, Chemistry, or Materials Science.
• Collaborative with strong communication skills.
• Problem solving methodology.
• Program management / time management skills.