Staff PKG Development Engineer

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

Position: Staff Packaging Development Engineer 

Locations: Hanoi, Vietnam

Overview: 

Qorvo seeks a seasoned Packaging Development Engineer with a robust background in semiconductor packaging development and integration. This role involves leading new packaging technologies and assembly capabilities, with a focus on SMT process expertise and innovation in packaging solutions. 

Responsibilities: 

• Develop and integrate new semiconductor packaging technologies. 

• Manage technical projects for packaging technology advancement. 

• Serve as a lead expert in packaging assembly processes, especially SMT. 

• Innovate in package design, processes, and materials for next-generation solutions. 

• Offer technical guidance during development phases and address high-volume production challenges. 

• Spearhead projects from concept through to qualification and production in collaboration with R&D. 

• Support technical customer engagements and problem resolution. 

• Drive continuous process improvement (CPI) in packaging and support cross-functional areas. 

• Collaborate with offshore assembly, substrate partners, and suppliers. 

• Present project updates to executive management and contribute to patent creation. 

Qualifications: 

• Bachelors degree in Mechanical, Microelectronics, or Materials Engineering. Master’s degree in Mechanical, Microelectronics, or Material Engineering preferred . 

• 10+ years experience in packaging or semiconductor assembly. 

• Strong leadership and project management skills in packaging and assembly tech. 

• Expertise in package design and SMT process development. 

• Experience with heterogeneous integration, SiP, and various packaging forms. 

• Proficiency in technology/assembly process development across SMT, Die Attach, Wire Bond, etc. 

• Exceptional communication skills for idea sharing and presenting to large groups. 

• Familiarity with high volume manufacturing, ideally in the cellular handset market. 

• Solid problem-solving skills; Lean and/or Six Sigma certification is a plus. 

• Knowledge of JEDEC, AEC Q100/200, and TS16949 automotive standards. 

Application: 

Interested candidates are encouraged to apply, demonstrating their innovative contributions to packaging technology and leadership capabilities. 

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