Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

QORVO is looking for a Packaging Development Engineer to work in partnership with our Substrate R&D team and our component engineering group. Experience with PCB design software, surface mount devices (SMD), and/or spectrum analyzer test equipment is a plus. This position will be located full time in Vietnam and reporting into QORVO’s RF Packaging Center of Excellence located in Greensboro, NC.  Qorvo is looking for future leaders.  

Strong communication, presentation skills, and ability to excel in a dynamic collaborative team environment including working directly with the business unit design teams is necessary. 

Responsibilities include:

• Design PCB laminate test vehicles to support advanced RF substrate development.
• Manage internal SMD component database.
• Interface between Qorvo design community and worldwide supply base to support product development.
• Develop, qualify, and support clean launch of new laminate material sets and suppliers in line with centralized Qorvo processes and documentation standards.
• Design material and surface finish evaluations using screening tests and design of experiments to improve product.
• Utilize program management methodology to plan, execute and monitor SMD and substrate development projects.
• Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities. 
• Travel to laminate PCB suppliers and SMD suppliers to provide technical support for technology development, supplier qualification and problem resolution.

Desired Skills:

• Familiarity with SMD Components such as inductors and capacitors.
• Experience with PCB design software such as Altium or Cadence.
• Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc. is a plus.
• Strong communication skills
• Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g.  DMAIC, 8D).
• Understanding of Design for Manufacturability and requirements needed to ramp technologies in a high volume-manufacturing environment.
• Effective project management skills
• Fluent in English. Korean, Mandarin, or Japanese is a plus.

Required Experience:

• Bachelor’s or higher degree in Physics or Engineering disciplines

#LI-MP1

MAKE A DIFFERENCE AT QORVO   

 We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.