Packaging Engineer

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

ABOUT THE POSITION:

Qorvo is looking to hire a Semiconductor Packaging Engineer with strong problem-solving skills, and enthusiasm for leadership and growth. The ideal candidate will have excellent communication and presentation skills, and the ability to excel in a dynamic collaborative team environment including working directly with design teams and business units.

This position will report into Qorvo’s DPS (Die Processing Services) center of excellence located in Apopka Florida, US.

RESPONSIBILITIES:

1. Support DPS engineering team and external suppliers in wafer grinding, dicing, and TnR processes.
2. Work in a dynamic collaborative team environment.
3. Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing processes.   
4. Prepare product/process reports by collecting, analyzing, and summarizing information.
5. Provide engineering information by answering questions and requests. 
6. Contribute to team effort by accomplishing related results as needed. 
7. Integrate new technology into existing processes. 
8. Develop, qualify and support clean launch of new DPS processes with documentation. 
9. Utilize program management methodology to plan, execute and monitor complex processes and/or product development projects. 
10. Travel to factories and suppliers to provide technical support.

REQUIREMENT/ QUALIFICATIONS: 

• Minimum of a BS or higher in engineering (Process/ Packaging/ Mechanical/ Electronics)
• Having at least 5 years of experience is required.
• Learn fast in a high paced environment. 
• Foundation in lean manufacturing principles and ability to utilize structured problem-solving methodologies (e.g.  DMAIC, 8D) preferred. 
• Ability to self-start and work independently.
• Ability to work flexible hours and/or travel depending on the needs of the business. 
• Effective project management skills
• Strong time management, organizational skills, and ability to set priorities for multiple tasks. 
• Strong communication and presentation skills.
• High level of customer focus both internally and externally.
• Fluent in Microsoft Office products (Excel, Word, PowerPoint, etc.).
• Foundation in solid modeling and TIBCO Spotfire preferred.
• Experience with wafer thinning, dicing (laser and blade) and DTR processes is a plus.
• Proficient in English.

MAKE A DIFFERENCE AT QORVO  

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

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