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Sr. Product Packaging Engineer 1

Experience Level:  Individual Contributor
Job Type:  Full-Time

NC - Greensboro (HQ), US

Requisition ID:  3453

Locations include:  Greensboro, NC; Hillsboro, OR; Richardson, TX

Design Center Locations: Chandler, AZ; Chelmsford, MA; Apopka, FL


Qorvo (Nasdaq:QRVO) is a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies. Qorvo is recognized for its diverse portfolio of semiconductor technologies and RF systems. Our products are utilized  in a diverse RF market  that include the world’s  leading suppliers of mobile phones, cellular infrastructure, commercial radios, Aerospace and Defense, and other communications equipment.


Qorvo is looking for experienced Semiconductor Packaging Engineers with demonstrated success in RF Packaging who can join Qorvo’s Packaging Center of Excellence, in Greensboro, NC.

Ideal candidate will utilize their broad semiconductor packaging experience to develop and drive new packaging technologies for next generation product requirements from concept to high volume manufacturing.

Strong communication and presentation skills.  Ability to excel in a dynamic collaborative team environment including working directly with the product line design teams.



  • Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions. 
  • Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
  • Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and/or problem solving.
  • Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing. 
  • Develop and deploy advanced design rules into next generation products. 
  • Work in collaboration with technology and business units to deploy next generation packaging solutions incorporating GaN, Si and GaAs semiconductor devices into products



  • Thorough industry knowledge and experience of semiconductor packaging technologies.
  • Strong background in process / packaging technologies preferably with direct experience in either RF Modules or high power and high frequency packages.
  • Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminate, etc.
  • Strong understanding of Design for Manufacturability and requirements needed to ramp these technologies in a high volume manufacturing environment
  • Proven track record of supporting New Product and/or Technology through innovative packaging solutions.
  • Ability to utilize SPC techniques, DOE, and structured problem solving methodologies (e.g.  DMAIC, 8D).
  • Experience with Program Management Methodology.


Locations include:  Greensboro, NC; Hillsboro, OR; Richardson, TX

Design Center Locations: Chandler, AZ; Chelmsford, MA; Apopka, FL




We are Qorvo. We do more than create innovative RF solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.


We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.

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