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Semiconductor Packaging Engineer, Intern

Experience Level:  Internship
Job Type:  Intern
Location: 

NC - Greensboro (HQ), US

Requisition ID:  2271

Semiconductor Packaging Engineering, Internship

 

Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion.  Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about  Top 10 Reasons to make a career at Qorvo.

 

NOTE: Because this is a student internship, candidate must be a currently enrolled student in a degree-seeking accredited program.

This is a full-time Intern position located in Greensboro, NC. The position will be temporary in nature and last approximately 3-months.

 

Job Summary:

Packaging intern will be exposed to full process flow for semiconductor assembly packaging.  Knowledge will be gained in post wafer fabrication bumping, die processing services, flip chip die attach, mold, laser marking, singluation, and shielding.
Depending on candidate experience, 1 of 3 projects will be selected:

  1. Die Process Services equipment footprint and future alignment across all Qorvo sites.
    • Activities would include line tours in GSO to understand equipment, Teams meeting with other sites, discussion with equipment vendors on roadmaps.
    • Goal of project is presentation with full explanation of current state and future roadmap.
  2. Shield effectiveness study.
    • Activities would be review of prior studies, literature search, test vehicle creation, measurements, and documentation of procedures.
    • Goal of project would be deepen understanding of shield impact to design and a procedure for future testing.
  3. Technology project introduction automation improvement.
    • GO Packaging typically manages 50 active projects at any given time varying in scope, duration, and support needs.  Activities will include analysis of project deliverables, duration, slippage, and categorization.
    • Goal of project would be to implement improvements to increase efficiency in project deliverables.

 

Desired Degree:

BS in Mechanical Engineering

 

Responsibilities:

• Learn best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions. 
• Develop and deploy Advanced Packaging Roadmaps. 
• Comfortable in hands-on environment working with assembly and analysis equipment. 
• Utilize program management methodology to plan, execute and monitor complex process and/or product development projects with a cross-functional global engineering team. 
• Work in collaboration with technology and business units to deploy next generation packaging solutions incorporating GaAs, GaN, Si and Acoustic semiconductor devices into products.

 

Qualifications:

  • Core process engineering thinking
  • Open growth mindset
  • Collaborative with strong communication skills
  • Problem solving methodology
  • Program management / time management skills

 

The above duties are not intended to be all-inclusive or permanent. The requirements of the position may change based on the business need. Duties, responsibilities, and activities may change.

 

Position Location: Greensboro, NC

Remote Eligible: No

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Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.


Nearest Major Market: Greensboro

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