Design Engineer

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

DUTIES:  Module level design, modeling, and integration of PAs, LNAs, switches and filters into highly compact multi-chip modules (MCM).  This specifically involves working with: microwave/RF Front-End circuit design like PA or LNA design details (DC bias, Bias Tee, Stability, impedance matching etc.) and RF testing. Further, any experience stated herein to involve: (2) integrating module dies such as amplifiers, switches, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive RF front-end modules (FEMs); use of RF CAD tools (ADS and/or Cadence Simulation and Layout) and EM simulators such as ADS Momentum, ADS FEM, and/or Ansys HFSS in conjunction with circuit simulators to accurately predict overall circuit performance;  responsibility for Electromagnetic (EM) Simulation tools ADS FEM/Ansys HFSS to develop laminate-based modules; and  supporting Full Module Simulation. Moreover, work in close communication and cooperation with design, modeling, and process engineering teams to generate, implement and support best-in-industry Nonlinear and Linear models. Characterization, verification, and debugging of the design through lab measurements with data analysis and programming tools such as Spotfire and Excel. Designing III-V microwave/millimeter-wave MMIC amplifiers, switches, phase shifters, attenuators, time-delay units (TDUs), hybrid multichip modules, or transmit/receive front-end modules (FEMs). Support product through critical lifecycle stages including concept/feasibility, development, qualification, and production  

MINIMUM REQUIREMENTS:  MINIMUM REQUIREMENTS: Bachelor’s degree in Electrical Engineering with coursework Radio Frequency focus, and 3 years of work experience. Additionally, 1 year of experience to involve knowledge or understanding of: (1) microwave/RF Front-End circuit design like PA or LNA design details (DC bias, Bias Tee, Stability, impedance matching etc.) and RF testing. Further, any experience stated herein to involve: (2) integrating module dies such as amplifiers, switches, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive RF front-end modules (FEMs); (3) use of RF CAD tools (ADS and/or Cadence Simulation and Layout) and EM simulators such as ADS Momentum, ADS FEM, and/or Ansys HFSS in conjunction with circuit simulators to accurately predict overall circuit performance; (4) responsibility for Electromagnetic (EM) Simulation tools ADS FEM/Ansys HFSS to develop laminate-based modules; and (5) supporting Full Module Simulation.

ALTERNATIVE REQUIREMENTS: In lieu of a Bachelor’s degree, employer will accept a Master’s degree in Electrical Engineering with coursework Radio Frequency focus, and 1 year of work experience or 9 graduate credit hours to involve knowledge or understanding of: (1)  microwave/RF Front-End circuit design like PA or LNA design details (DC bias, Bias Tee, Stability, impedance matching etc.) and RF testing. Further, any experience or graduate coursework stated herein to involve: (2) integrating module dies such as amplifiers, switches, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive RF front-end modules (FEMs); (3) use of RF CAD tools (ADS and/or Cadence Simulation and Layout) and EM simulators such as ADS Momentum, ADS FEM, and/or Ansys HFSS in conjunction with circuit simulators to accurately predict overall circuit performance; (4) responsibility for Electromagnetic (EM) Simulation tools ADS FEM/Ansys HFSS to develop laminate-based modules; and (5) supporting Full Module Simulation

This position is not eligible for visa sponsorship by the Company. 

MAKE A DIFFERENCE AT QORVO   

 We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.