Packaging Engineer

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Join Qorvo’s Packaging Modeling Team as a Packaging Engineer focused on advancing simulation methodologies for our diverse product catalog. This role is ideal for a creative, technically driven professional passionate about improving reliability, quality, performance, and cost through innovative modeling solutions. You’ll collaborate closely with global teams and contribute to the next generation of packaging technologies.

This is an onsite role based in Barcelona Spain where the expectation is to be in the office five days a week.

Key Responsibilities:

• Conduct thermal, mechanical, and thermo-mechanical FEA simulations for various Qorvo devices and package types
• Develop and refine simulation methodologies to enhance speed and accuracy
• Support business units with mechanical engineering expertise
• Identify potential quality risks and propose effective solutions
• Optimize model size, detail, and generation processes to reduce simulation cycle times
• Collaborate with cross-functional teams across Qorvo to drive technology improvements

Required Qualifications:

• Masters degree in Physics, Mechanical/Electrical Engineering, Material Science, or related field
• Strong understanding of thermal physics and processes
• Experience with FEA/FEM simulation tools
• Excellent presentation and communication skills
• Proven ability to work effectively in a global, collaborative environment
• Proficiency in packaging and semiconductor technologies
• Fluent in English

Preferred Qualifications:

• Ph.D. in Physics, Mechanical/Electrical Engineering, Material Science, or related field
•  Experience in packaging engineering, mechanical or materials engineering, reliability engineering, or a related technical field, with a focus on simulation, modeling, or process optimization.

• Hands-on experience with Ansys Mechanical
• Basic knowledge of RF circuit design

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MAKE A DIFFERENCE AT QORVO   

 We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.