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Sr. Development Engineer

Experience Level:  Individual Contributor
Job Type:  Full-Time
Location: 

FL - Apopka, US

Requisition ID:  2974

Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion.  Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about  Top 10 Reasons to make a career at Qorvo.

 

 

SUMARRY:

This work entails all aspects of development of packaging technology for a wide range of applications. A background in RF and microwave is expected. A solid understanding of packaging technology and processes will have to be acquired in a rapid fashion as this person will work as an interface between the packaging team and other technologies and design teams.

The ideal candidate is a technical person, who finds solving challenging problems to be a rewarding task. We desire a creative and highly motivated individual with a can-do attitude. The candidate needs to be comfortable working with and support other groups like technologists, design engineering, manufacturing, etc. 

 

RESPONSIBILITIES: 

  • Design and simulation of state-of-the-art packages for a diverse set of applications and semiconductor technologies.
  • Coordinate with packaging teams to drive packaging technology decisions; data collection requirements, communicating with stakeholders, and conducting comprehensive studies.
  • Support execution of packaging technology roadmap from concept to validation and qualification.
  • Collaborate with R&D technology teams, coordinating roadmaps, developing, and promoting best practices to design community.
  • Work closely with design teams to accelerate deployment of latest packaging technologies into products. 

 

QUALIFICATIONS: 

  • BS, MS or PhD degree in Electrical/Electronic Engineer or related.
  • Background in electromagnetics, RF module design and integration.
  • Knowledge of circuit simulation tools (AWR or ADS) and EM simulation (HFSS, CST, or equivalent).
  • Familiar with microwave measurements and RF test equipment.
  • Knowledge of process and manufacturing of semiconductor devices, stackups and material properties are desired.
  • Knowledge of packages technologies and assembly processes (e.g., SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, etc.) are desired.

MAKE A DIFFERENCE AT QORVO   

 

We are Qorvo. We do more than create innovative RF solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

 

We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.


Nearest Major Market: Orlando

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