Sr BAW R&D Process Integration Engineer

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

SUMMARY:

Our Bulk Acoustic Wave (BAW) business is rapidly growing. Our BAW R&D team seeks a Sr BAW R&D Process Integration Engineer to focus on process integration and new technology development.  In our ongoing effort to improve device performance and diversify our product spectrum, we need a creative person who can integrate complex thin film processes (more than ten levels of lithography). The ideal candidate is a technical person, who finds solving challenging problems to be a rewarding task. 

RESPONSIBILITIES: 

Our BAW business is growing rapidly, and we desire a highly motivated individual to be part of this opportunity.

• The candidate will provide MEMS, thin films process integration support to include developing and transferring processes from R&D to high volume semiconductor manufacturing environment.
• The candidate will support process engineering, design engineering and manufacturing teams.
• Provide support for BAW resonators using  AIScN thin films.
• Conduct ferroelectric characterization of AlScN thin film capacitor devices

QUALIFICATIONS:

• PhD degree in physics, material science & engineering or related fields.
• Curriculum or experience in MEMS, thin films integration or thin films for acoustic devices is required.
• Relevant experience or prior internship in semiconductor/MEMS industry as a process integration / technology development engineer.
• Experience or prior internship in developing/transferring processes from R&D to high volume manufacturing is desired.
• Prior BAW / acoustic devices experience is a plus
• Prior BAW process or device engineering experience or internship is a plus
• Knowledge of the various standard semiconductor processing techniques (PVD, CVD, Thin Film Deposition (Sputtering, PECVD, ALD), SEM, EDS, TEM, XRD, Profilometer, Wire-bonding, lithography, Wet Etching, CMP, RIE, DRIE is desired.
• Knowledge of Device Characterization tools: Vector Network Analyzer, Piezo-MEMS Analyzer, Laser Vibrometer, Holographic Microscope
• Skills in MATLAB, C++, Python, COMSOL-Multiphysics, Keysight, Cadence Virtuoso, Solidworks, OriginPro desired.

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MAKE A DIFFERENCE AT QORVO   

 We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.