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Sr Mechanical Engineer

Experience Level:  Individual Contributor
Job Type:  Full-Time
Location: 

TX - Richardson, US

Requisition ID:  1056

RESPONSIBILITIES

  • Senior level Mechanical Engineer team member developing next generation micro-electronics packaging technology solutions integrating RF, analog, and digital technology semiconductor devices
  • Chosen candidate will work closely with select team of IC designers, circuit designers, process engineers, and CAD tool set specialists to develop IC products and development tools to move the state of the art packaging technology forward
  • Using ANSYS and other industry standard simulations tools:
    • Perform detailed modeling and optimization of thermal/cooling design at the die/package/PCBA level
    • Perform mechanical stress modeling and optimization  at the die/package/PCBA level
    • Develop parametric tools for thermal and stress modeling for internal and external customers
  • Using simulation results guide package and substrate design decisions that meet performance specifications and yield requirements.
  • In conformance with Qorvo standards, develop and document new products for prototype, limited production, and production release.
  • Supervise and respond to manufacturing issues as they occur.
  • Maintain view of packaging technology trends across RF and millimeter wave GaN, GaAs, Digital Si, and Analog Si.  Provide inputs to implement these technology trends for our customers benefit.

 

QUALIFICATIONS:

  • BSME/MSME degree in mechanical engineering with a minimum of 10 years’ experience in semiconductor packaging.
  • Experience in the design of electronics for the defense, avionics, aerospace, or automotive industries.
  • Expert level skill with ANSYS and Solidworks
  • Knowledge of legacy and advanced microelectronic package technologies, materials, manufacturing methods, plating, and interconnect technologies.
  • Experience with microelectronic package assembly processes including wafer bumping, wafer grind, dice and pick, die attach, wire bond, flip chip, epoxy dispense, encapsulation, hermeticity considerations, and reflow
  • Knowledge of microelectronic inspection tools and equipment including capabilities and limitations.  Similar knowledge of failure analysis techniques and equipment
  • Knowledge of Reliability calculation methods for semiconductors in the defense market.
  • Understanding of GD&T, ANSI standards and tolerance stack-ups required
  • Demonstrated ability to work with cross-functional teams
  • Excellent verbal communication and interpersonal skills
  • Excellent written communications skills
  • Ability to obtain a Security Clearance
  • US citizenship

 

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MAKE A DIFFERENCE AT QORVO   

 

We are Qorvo. We do more than create innovative RF solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

 

We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.


Nearest Major Market: Dallas
Nearest Secondary Market: Fort Worth

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