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Mechanical Engineer

Experience Level:  Individual Contributor
Job Type:  Full-Time
Location: 

TX - Richardson, US

Requisition ID:  3561

If you are a Mechanical Engineer and would like to be part of an excellent team doing development, design, and manufacturing of highly technical, next generation products with a growing company, please apply!  There are tons of reasons to at least explore this opportunity and find out how we can help you advance your career!

 

The key responsibility of this assignment is to provide technical support for the development of RF/microwave/millimeter-wave Integrated Circuits (ICs) and Multi-Function Modules used in a variety of commercial and defense system applications. You will be working with other engineers and our project team to develop the mechanical approach, materials selection, thermal design, interconnect architecture and assembly flow. You will use analysis software, physical prototyping, and lab testing to ensure that the design will meet all project requirements for specification compliance, robustness, manufacturability, and cost.

 

You will be a vital member of an integrated product development team including RF Engineers, Process Engineers, Assembly Engineers, Quality Engineers, Application Engineers, CAD personnel, Program Management, and our customers to ensure the products Qorvo develops are solid and well thought out designs that meet or exceed all contractual requirements.

 

RESPONSIBILITIES:

  • Analysis and modeling of semiconductor process thermal characteristics
  • Thermal and stress FEA analysis and optimization using ANSYS
  • Design piece parts and assemblies
  • Create and review fabrication and process control drawings
  • Mechanical 3D design and modeling using SolidWorks
  • Design of tooling and fixtures for product Validation and Qualification activity
  • Interface with materials suppliers and machine shops

 

QUALIFICATIONS:

  • BSME/MSME degree in mechanical engineering with a minimum of 5 years’ experience in semiconductor packaging, materials, and thermal modeling.
  • Experience in the design of electronics for the defense, avionics, aerospace, or automotive industries.
  • Expert level skill with ANSYS and SolidWorks
  • Experience or knowledge of different thermography techniques including IR imaging, thermo reflectance, and uRaman
  • Knowledge of legacy and advanced microelectronic package technologies, materials, manufacturing methods, plating, and interconnect technologies.
  • Experience with microelectronic package assembly processes including wafer bumping, wafer grind, dice, pick, die attach, wire bond, flip chip, epoxy dispense, encapsulation, hermeticity considerations, and reflow
  • Knowledge of a broad set of materials and their properties including heat spreaders, laminates, ceramics, and epoxies
  • Knowledge of microelectronic inspection tools and equipment including capabilities and limitations.  Similar knowledge of failure analysis techniques and equipment.
  • Knowledge of JEDEC and military test standards (e.g., MIL-STD-883) and reliability calculation methods for semiconductors in the defense market.
  • Understanding of GD&T, ANSI standards, and tolerance stack-ups required
  • Experience with Statistical Process Control and Design of Experiments is desirable
  • Demonstrated ability to work with cross-functional teams
  • Excellent verbal communication and interpersonal skills
  • Excellent written communications skills
  • Ability to obtain a Security Clearance
  • US citizenship

 

 

Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion.  Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success.

 

It is an exciting time to be a part of Qorvo’s Infrastructure and Defense Products. Qorvo’s IDP manufactures and markets high performance RF and mixed signal integrated circuits for the communications markets that connect, protect and power the world. Our customers trust Qorvo to meet and exceed requirements and deliver advanced RF technologies to enable their most complex technical challenges and applications. Our products address connectivity both wired and wireless networks, the smart home and the IoT, broadband, aerospace, defense, and automotive.  Our customers rely on us to solve the industry’s most complex engineering problems. And that takes brain power and willingness to create and innovate.  Join us and help us continue to create cutting edge technologies for a more connected world all around you.

 

Because this position is part of a business unit that contracts with the US government, qualified candidates must be U.S. citizens eligible to obtain DoD Clearance.

 

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MAKE A DIFFERENCE AT QORVO   

 

We are Qorvo. We do more than create innovative RF solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

 

We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.

 

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.

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