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Modeling Engineer Intern

Experience Level:  Internship
Job Type:  Intern

NC - Greensboro (HQ), US

Requisition ID:  2402


Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion.  Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about  Top 10 Reasons to make a career at Qorvo.


NOTE: Because this is a student internship, candidate must be a currently enrolled student in a degree-seeking accredited program.


This is a full-time Intern position located in Greensboro, NC. The position will be temporary in nature and last approximately 3-months.


Desired Degree: BS Electrical Engineering

Job Summary:

Thin film SOI technologies utilize a semi-insulating substrate to provide improved RF isolation over that of a highly doped low resistivity substrate.  An accurate model of this substrate’s electrical performance is critical to predict the device-to-device RF coupling in a design. Existing substrate coupling models do not predict the coupling accurately enough as a function of device geometry and wafer thickness.  In this project you will review the current substrate coupling methodology, research other approaches, measure on-wafer coupling structures, and develop an improved model.



  • 3.0 GPA or higher
  • At least a BS in EE or ECE. Good communication skills. A basic understanding of silicon devices. Ability to work well in a group. A basic understanding of silicon circuit design.


  • Assess the currently used substrate coupling substrate models to identify strengths and weaknesses.
  • Perform a literature search to identify potential improvements to the existing approach. 
  • Measure the RF Response (S-Parameters) of on-wafer substrate coupling characterization structures in the lab.
  • Extract a geometry dependent model using the measured S-Parameter data that accurately captures the lateral and vertical coupling through the thin film SOI substrate.
  • Validate the model by comparing it to Electromagnet (EM) base simulations of the substrate.
  • Code the model in SPICE/Verilog-A syntax, simulate the coupling for numerous active and passive devices, and compare to measured results.


Location: Greensboro, NC


The above duties are not intended to be all-inclusive or permanent. The requirements of the position may change based on the business need. Duties, responsibilities, and activities may change.



Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.

Nearest Major Market: Greensboro

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